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Posts Tagged ‘Mike Mediana’

Advantages of Ultrasonic Welding for Packaging Applications

Posted in Food & Beverage, Packaging, Precision Welding-Assembly-Cleaning on Wednesday, September 27th, 2017. No comments yet
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Today on the final day of PACK EXPO 2017, Emerson’s Mike Mediana presented on the topic, Migrating from Traditional Package Sealing Technologies to Ultrasonics in Flexible Packaging Applications. Mike’s presentation focused on how consumer preference is driving the increasing demands for flexible packaging in the medical, consumer product, and food and beverage industries. He shared […]